Question 1

How long has Device Engineering Incorporated been in business?

Accepted Answer

Device Engineering Incorporated is proud to be celebrating our 30th year of business as of May 2020. We would like to thank all of our customers, business partners, and employees for their essential role in our success. We look forward to strengthening our relationships and expanding our business with; and continuing our support to, all of our existing and yet-to-be customers in the future.

Question 2

What Quality Certifications does Device Engineering Incorporated (DEI) have?

Accepted Answer

Device Engineering Incorporated (DEI) has been certified by Perry Johnson Registrars, Inc. (who are accredited by ANAB), to be compliant to the AS9100D aerospace quality standard as well as the ISO 9001:2015 quality standard. View our Certificate of Registration. AS9100D is the newest version of the aerospace industry standard, it incorporates all the elements of ISO 9001:2015, plus additional elements unique to Aviation, Defense and Space organizations. Aerospace Standard AS9100D Quality Management Systems - Requirements for Aviation, Space, and Defense Organizations were prepared by the IAQG. The industry has established the International Aerospace Quality Group (IAQG), with representatives from companies in the Americas, Asia/Pacific, and Europe. International Standard ISO 9001:2015 Quality Management Systems was prepared by Technical Committee ISO/TC 176, Quality management and quality assurance, Subcommittee SC 2, Quality systems. These standards are increasingly important to the thousands of companies that supply parts and services to aircraft and aerospace manufacturers. All of the major aircraft engine manufacturers and users, such as General Electric Aviation Aircraft Engine division (GEAE), Boeing, Airbus, Rolls-Royce, and UTAS, require registration to AS9100D. DEI Purchasing Quality Requirements.

Question 3

Does Device Engineering Incorporated (DEI) have RoHS/REACh/Conflict Minerals certifications?

Accepted Answer

Lead (Pb) Free / RoHS / REACh Policy / Conflict Minerals Reporting: Device Engineering Incorporated (DEI) has developed RoHS and Lead-Free products whilst maintaining legacy processes for Military and Space exemptions (Articles 4a, 4b of Directive 2011/65/EU) as required by these customers. DEI is committed to offering Pb-free, RoHS compliant product options for all products in order to reduce or eliminate hazardous substances in packaging, for all our customers both inside and outside the Aerospace industry. More Information: European Union RoHS I Directive (Repealed 3 January 2013). European Union RoHS II Directive. European Union WEEE Directive. IPC Pb-Free Information. REACh (EC 1907/2006) is the European Community Regulation on chemicals and their safe use. It deals with the Registration, Evaluation, Authorisation, and Restriction of Chemical substances. The law entered into force on 1 June 2007. The current Candidate List of Substances of Very High Concern. Current DEI RoHS3 & REACh Statement. Current DEI Conflict Minerals Reporting Template.

Question 4

What are DEI's Production and Test Capabilities?

Accepted Answer

DEI has the Production and Test capabilities to deliver your standard or custom Military, Avionics, Commercial, and Industrial Integrated circuits in almost any volume. Be it a limited number of devices for a one time order, or full high volume production levels; DEI can deliver the product at the lowest price commensurate with the best quality, reliability, and availability. Capabilities: Wafer Testing: Wafer Probe Stations, Hot Chuck Probing @ +125°C; Packaging:Plastic Production Flows for: MLPQ/QFN, MQFP, PQFP, TQFP, LQFP, DIP, PLCC, SOIC, TSSOP; Ceramic Production Flows for: DIP, CLCC, CPGA, CQFP, SOIC; Production Screening/QCI Testing: 3 - ASL3000 Analog/RF Testers, 2 - ASL1000 Analog Testers, 3 - Thermionics TFUs, Hot/Cold Electrical Testing, Burn-In Ovens, MIL-STD-883 Method 5004, HAST Testing; Device Marking Capable; Dry Pack Capable; IC Handlers for Volume Production: SOIC & TSSOP, PLCC, DIP, MLPQ/ QFN, PQFP & MQFP.

Part #	temp range	product package type
DEI1026A-SES-G	16 SOIC NB G	-55 to 85
DEI1026A-SMS-G	16 SOIC NB G	-55 to 125
DEI1026A-WMB	16 CSOP E	-55 to 125
DEI1026A-WMS	16 CSOP E	-55 to 125
DEI1026-G	16 SOIC NB G	-55 to 85
DEI1026-WMB	16 CSOP E	-55 to 85
DEI1026-WMS	16 CSOP E	-55 to 85
DEI1054-G	16 SOIC NB G	-55 to 85
DEI1054-SMS-G	16 SOIC NB G	-55 to 125
DEI1054-WMB	16 CSOP E	-55 to 125
DEI1054-WMS	16 CSOP E	-55 to 125
DEI1066-SES-G	16 SOIC NB G	-55 to 85
DEI1066-SMB-G	16 SOIC NB G	-55 to 125
DEI1066-SMS-G	16 SOIC NB G	-55 to 125
DEI1067-SES-G	16 SOIC NB G	-55 to 85
DEI1160A-SMS	16 SOIC EP NB	-55 to 125
DEI1166-TES-G	24 TSSOP G	-55 to 85
DEI1166-TMS-G	24 TSSOP G	-55 to 125
DEI1167-TES-G	24 TSSOP G	-55 to 85
DEI1167-TMS-G	24 TSSOP G	-55 to 125
DEI1184-SES	16 SOIC EP NB	-55 to 85
DEI1184-SMS	16 SOIC EP NB	-55 to 125
DEI1188-SES	16 SOIC EP NB	-55 to 85
DEI1188-SMS	16 SOIC EP NB	-55 to 125
DEI1198-TES-G	24 TSSOP G	-55 to 85
DEI1198-TMS-G	24 TSSOP EP G	-55 to 125
DEI1282-SES	16 SOIC EP NB	-55 to 85
DEI1282-SES-G	16 SOIC EP NB G	-55 to 85
DEI1282-SMS	16 SOIC EP NB	-55 to 125
DEI1282-SMS-G	16 SOIC EP NB G	-55 to 125
DEI1284-SES-G	16 SOIC EP NB G	-55 to 85
DEI1284-SMS-G	16 SOIC EP NB G	-55 to 125

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