Discrete-to-Digital Interface IC's
What are Discrete-to-Digital Interface IC's?
Device Engineering offers over 30 Discrete-to-Digital interface IC's for the avionics and industrial markets. These devices accept either six or eight parallel inputs. Some models convert the parallel inputs to an SPI serial data stream and conform to ABD0100H (Airbus Directive). The entire line of Discrete-to-Digital products includes DO-160D lightning protection, assuring system longevity. Scroll further down to the Applications section below to learn how Discrete-to-Digital Interface IC's (Integrated Circuits) can be applied to a wide variety of applications.
Sensing applications in commercial aircraft include:
- Door and Slide position
- Angle of Attack
- Direction
- Airspeed
- Altitude
- Pressure
- Ice
- Weight
- Temperature
- Flow
- RPM
- Particle Detection
- Voltage
- Electrical Current
- Fire/Flame
- Carbon Dioxide
For military aircraft:
- Vertical Situational Display Unit (VSDU)
- Fully Integrated Datalink System (FIDL)
- Central Integrated Test Systems (CITS)
- Synthetic Vision Avionics Backbone (SVAB)
- Degraded Environment Pilotage Systems (DVEPS)
Filter By:
Product Package Types
12 DFN 6.15x7.7x1.4 G
14 SOIC NB G
16 4X4 I MLPQ G
16 CERDIP
16 CERDIP G
16 CSOP
16 CSOP E
16 SB DIP P
16 SOIC EP NB
16 SOIC EP NB G
16 SOIC NB G
16 SOIC WB G
16 SOICW I EP G
20 5x5 C MLPQ G
20 5x5 I MLPQ G
20 CERDIP
20 CERDIP G
20 CLCC P
20 SOIC WB
20 SOIC WB G
20 TSSOP G
24 TSSOP EP G
24 TSSOP G
28 CLCC
28 CLCC P
28 PLCC
28 PLCC G
38 5x7 C MLPQ G
38 5x7 I MLPQ G
38 TSSOP G
40 SB DIP A
44 7X7 I MLPQ G
44 8X8 I MLPQ G
44 CLCC
44 MQFP2 G
44 PLCC A
44 PLCC A G
44 PLCC C G
44 PQFP
44 PQFP G
52 CQFJ
52 MQFP G
64 9X9 C MLPQ G
8 EP SOIC G
8 SB DIP
8 SOIC NB G
Temperature Range
-40 to 125
-40 to 85
-55 to 105
-55 to 125
-55 to 85
Output Resistance
0
7.5
10
13
27.5
37
37.5
or 37.5
user selectable: 0
user selectable: 5
user selectable: 7.5
Tri State Outputs
FALSE
TRUE
Fused Outputs
FALSE
TRUE
| Part # | temp range | product package type | tri state outputs | fused outputs | Quote |
|---|---|---|---|---|---|
| DEI1026A-SES-G | 16 SOIC NB G | -55 to 85 | |||
| DEI1026A-SMS-G | 16 SOIC NB G | -55 to 125 | |||
| DEI1026A-WMB | 16 CSOP E | -55 to 125 | |||
| DEI1026A-WMS | 16 CSOP E | -55 to 125 | |||
| DEI1026-G | 16 SOIC NB G | -55 to 85 | |||
| DEI1026-WMB | 16 CSOP E | -55 to 85 | |||
| DEI1026-WMS | 16 CSOP E | -55 to 85 | |||
| DEI1054-G | 16 SOIC NB G | -55 to 85 | |||
| DEI1054-SMS-G | 16 SOIC NB G | -55 to 125 | |||
| DEI1054-WMB | 16 CSOP E | -55 to 125 | |||
| DEI1054-WMS | 16 CSOP E | -55 to 125 | |||
| DEI1066-SES-G | 16 SOIC NB G | -55 to 85 | |||
| DEI1066-SMB-G | 16 SOIC NB G | -55 to 125 | |||
| DEI1066-SMS-G | 16 SOIC NB G | -55 to 125 | |||
| DEI1067-SES-G | 16 SOIC NB G | -55 to 85 | |||
| DEI1160A-SMS | 16 SOIC EP NB | -55 to 125 | |||
| DEI1166-TES-G | 24 TSSOP G | -55 to 85 | |||
| DEI1166-TMS-G | 24 TSSOP G | -55 to 125 | |||
| DEI1167-TES-G | 24 TSSOP G | -55 to 85 | |||
| DEI1167-TMS-G | 24 TSSOP G | -55 to 125 | |||
| DEI1184-SES | 16 SOIC EP NB | -55 to 85 | |||
| DEI1184-SMS | 16 SOIC EP NB | -55 to 125 | |||
| DEI1188-SES | 16 SOIC EP NB | -55 to 85 | |||
| DEI1188-SMS | 16 SOIC EP NB | -55 to 125 | |||
| DEI1198-TES-G | 24 TSSOP G | -55 to 85 | |||
| DEI1198-TMS-G | 24 TSSOP EP G | -55 to 125 | |||
| DEI1282-SES | 16 SOIC EP NB | -55 to 85 | |||
| DEI1282-SES-G | 16 SOIC EP NB G | -55 to 85 | |||
| DEI1282-SMS | 16 SOIC EP NB | -55 to 125 | |||
| DEI1282-SMS-G | 16 SOIC EP NB G | -55 to 125 | |||
| DEI1284-SES-G | 16 SOIC EP NB G | -55 to 85 | |||
| DEI1284-SMS-G | 16 SOIC EP NB G | -55 to 125 |
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