Package Types

Device Engineering's products are offered in many popular packages ranging from DIP's to u-BGA's. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required. For custom, mixed-signal designs and product respins these same packages may be selected as applicable to your design

• DIP (Plastic, Ceramic, Side Brazed)
• SOIC - NB(150mil) or WB(300mil) 
• Plastic MLP, QFN, LPCC
• QFP
• CLCC
• SSOP
• TSSOP
• PLCC
• MQFP
• MLPQ
• PGA
• BGA
• µBGA
• TO-can
• J-Lead Cerquad
• Many more...