Custom IC Packages & ASIC Packaging
Device Engineering's standard products are provided in many popular packages ranging from DIP's to u-BGA's. Non-Standard packages such as heat spreaders are available too. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required.
- DIP (Plastic, Ceramic, Side Brazed)
- SOIC - NB(150mil) or WB(300mil)
- Plastic MLP, QFN, LPCC
- J-Lead Cerquad
- Many more...