Your browser is out of date.

You are currently using Internet Explorer 7/8/9, which is not supported by our site. For the best experience, please use one of the latest browsers.

View Quote (0)

Package Types

Device Engineering's products are offered in many popular packages ranging from DIP's to u-BGA's. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required. For custom, mixed-signal designs and product respins these same packages may be selected as applicable to your design


  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil) 
  • Plastic MLP, QFN, LPCC
  • QFP
  • CLCC
  • SSOP
  • PLCC
  • MQFP
  • MLPQ
  • PGA
  • BGA
  • µBGA
  • TO-can
  • J-Lead Cerquad
  • Many more...

Custom RF/Mixed-Signal ASIC's

Get in Touch