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Custom IC Packages & ASIC Packaging

Device Engineering's standard products are provided in many popular packages ranging from DIP's to u-BGA's. Non-Standard packages such as heat spreaders are available too. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required.

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil) 
  • Plastic MLP, QFN, LPCC
  • QFP
  • CLCC
  • SSOP
  • TSSOP
  • PLCC
  • MQFP
  • MLPQ
  • PGA
  • BGA
  • µBGA
  • TO-can
  • J-Lead Cerquad
  • Many more...

Custom ASCIs

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