DEI IC Product Packaging
Check out the following pages for in-depth DEI IC Packaging options and detail. DEI products come in a wide variety of popular package styles to meet size and pin-count requirements. Ceramic package options are available when added ruggedness and hermiticity are required.
Device Engineering's standard products are provided in many popular packages ranging from DIP's to u-BGA's.
Quality in Every Component
Learn more about DEI's Quality Certifications, QMS Programs, Supply Chain support and Testing capabilities