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IC Lead Finish Options

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DEI Lead Finish Options

Lead Free

The standard Lead Finish format for DEI devices is Lead(Pb)-Free. Several processes are used per JE DEC JESD97.   

The finish is specified with any of the below device marking codes:

e1:  SnAgCu
e2:  Sn alloy with no Bi or Zn
e3:  Pure Sn
e4:  Precious metal (NiPdAu or Au)
e5:  SnZn, E6 - Contains Bi
e7:  Low temp solder (<150 °C) contains In.0

For Pb-free products, the JEDEC lead finish code shall be marked on the package if room allows; preferably after the date code. The code may be marked with either the JEDEC symbol (circle around e#) or with normal text E#.

Tin/Lead (Sn/Pb)

Hot Solder Dip is offered as a customer-specified Lead Finish. Typically, the last digit on Hot Solder Dipped devices will be labeled: P, unless specified differently by the customer.

Tin/Lead Marking Code

P: Tin/Lead(Sn/Pb)

Custom ASICs

Device Engineering is a Tempe, AZ-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

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