IC Lead Finish Options
DEI Lead Finish Options
The standard Lead Finish format for DEI devices is Lead(Pb)-Free. Several processes are used per JE DEC JESD97.
The finish is specified with any of the below device marking codes:
e2: Sn alloy with no Bi or Zn
e3: Pure Sn
e4: Precious metal (NiPdAu or Au)
e5: SnZn, E6 - Contains Bi
e7: Low temp solder (<150 °C) contains In.0
For Pb-free products, the JEDEC lead finish code shall be marked on the package if room allows; preferably after the date code. The code may be marked with either the JEDEC symbol (circle around e#) or with normal text E#.
Hot Solder Dip is offered as a customer-specified Lead Finish. Typically, the last digit on Hot Solder Dipped devices will be labeled: P, unless specified differently by the customer.
Tin/Lead Marking Code
Device Engineering is a Tempe, AZ-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.