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Integrated Circuit Packaging Services, Semiconductor & IC Packaging

Device Engineering offers Integrated Circuit Packaging Services, Semiconductor Packaging and IC Packaging. DEI can package your custom circuits in most any standard package available in the industry from DIPs to u-BGA's. Non-Standard packages such as heat spreaders are available too. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required.

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Package Types & Diagrams

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil)
  • Plastic MLP, QFN, LPCC
  • QFP
  • CLCC
  • SSOP
  • TSSOP
  • PLCC
  • MQFP
  • MLPQ
  • PGA
  • BGA
  • µBGA
  • TO-can
  • J-Lead Cerquad
  • Many more...

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