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IC & ASIC Packages

Device Engineering's products are offered in many popular packages ranging from DIP's to u-BGA's. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required. For custom, mixed-signal designs and product respins these same packages may be selected as applicable to your design

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Package Types & Diagrams

  • DIP (Plastic, Ceramic, Side Brazed)
  • SOIC - NB(150mil) or WB(300mil)
  • Plastic MLP, QFN, LPCC
  • QFP
  • CLCC
  • SSOP
  • TSSOP
  • PLCC
  • MQFP
  • MLPQ
  • PGA
  • BGA
  • µBGA
  • TO-can
  • J-Lead Cerquad
  • Many more...

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