IC Design Services
DEI has decades of experience with RF, Mixed-Signal and Analog designs for Military, Avionics, Commercial, and Industrial Integrated Circuit Production Flows.
DEI has the capabilities and IC Design Services to deliver your custom integrated circuits in any volume. Whether you require a limited number of devices for a one time order, or full high volume production levels; DEI can deliver product at the lowest price commensurate with the high quality, reliability and availability.
Capabilities
Wafer Testing
Wafer Probe Stations, Hot Chuck Probing @ +125°C
Packaging Typical Production Flows
Plastic
- MLPQ/QFN
- MQFP
- PQFP
- TQFP
- LQFP
- DIP
- PLCC
- SOIC
- TSSOP
Ceramic
- DIP
- CLCC
- CPGA
- CQFP
- SOIC
Production Screening/QCI Testing
- ASL3000 Analog/RF Testers (Three)
- ASL1000 Analog Testers (Two)
- Thermonics TFUs (Three)
- Hot/Cold Electrical Testing
- Burn-In Ovens
- MIL-STD-883 Method 5004
- HAST Testing
Device Marking Capability
Laser, SilkScreen, Ink as provided by DEI's packaging partners
Device Shipping/Storage
Bake and Dry Pack
IC Handlers for Volume Production
- SOIC & TSSOP
- PLCC
- DIP
- MLPQ/ QFN
- PQFP & MQFP
Quality in Every Component
Learn more about DEI's Quality Certifications, QMS Programs, Supply Chain support and Testing capabilities
