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IC Design Services

DEI has decades of experience with RF, Mixed-Signal and Analog designs for Military, Avionics, Commercial, and Industrial Integrated Circuit Production Flows.

DEI has the capabilities and IC Design Services to deliver your custom integrated circuits in any volume.  Whether you require a limited number of devices for a one time order, or full high volume production levels; DEI can deliver product at the lowest price commensurate with the high quality, reliability and availability.

Capibilites 

Wafer Testing

Wafer Probe Stations, Hot Chuck Probing @ +125°C 

Packaging Typical Production Flows

Plastic

  • MLPQ/QFN
  • MQFP
  • PQFP
  • TQFP
  • LQFP
  • DIP
  • PLCC
  • SOIC
  • TSSOP

Ceramic

  • DIP
  • CLCC
  • CPGA
  • CQFP
  • SOIC

Production Screening/QCI Testing

  • ASL3000 Analog/RF Testers (Three)
  • ASL1000 Analog Testers (Two)
  • Thermonics TFUs (Three)
  • Hot/Cold Electrical Testing
  • Burn-In Ovens
  • MIL-STD-883 Method 5004
  • HAST Testing

Device Marking Capability

Laser, SilkScreen, Ink as provided by DEI's packaging partners

Device Shipping/Storage

Bake and Dry Pack

IC Handlers for Volume Production

  • SOIC & TSSOP
  • PLCC
  • DIP
  • MLPQ/ QFN
  • PQFP & MQFP 

Quality in Every Component

Learn more about DEI's Quality Certifications, QMS Programs, Supply Chain support and Testing capabilities

Learn More

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