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Services IC Design and Production Capabilities

Integrated Circuit Design Services & Avionics IC Design

By virtue of 30+ years of experience, Device Engineering matches the right processing technology with the product requirements.  There is no need to compromise on system design to fit processing capabilities.  Unlike other design houses who will design your circuits to the technology that is available to them, Device Engineering has no process technology limits. This allows us to design devices that both meet stringent requirements and are delivered at the lowest possible cost.

Low price/high volume, low power, low voltage, special signal conditioning, high voltage, and many more design capabilities can be utilized and mixed to fit your specific application.


  • CMOS: Silicon-Gate
  • BiPolar: CML, ECL
  • MOS
  • BiMOS
  • N - Channel Silicon Gate
  • P - Channel Silicon-Gate
  • P - Channel Metal Gate


  • CMOS: Silicon Gate
  • BiPolar: Low Voltage Schottky, 20/40 Volt Processing
  • BiMOS
  • DMOS

Production Capabilities

DEI has decades of experience with RF, Mixed-Signal, and Analog designs for Military, Avionics, Commercial, and Industrial Integrated Circuit Production Flows.

DEI has the capability to deliver your custom integrated circuits in any volume.  Whether you require a limited number of devices for a one time order, or full high volume production levels; DEI can deliver a product at the lowest price commensurate with the best quality, reliability, and availability


  • Wafer TestingWafer Probe Stations
  • Hot Chuck Probing @ +125°C 

Plastic Packaging

  • Typical Production FlowMLPQ/QFN
  • MQFP
  • PQFP
  • TQFP
  • LQFP
  • DIP
  • PLCC
  • SOIC

Ceramic Packaging

  • Typical Production FlowDIP
  • CLCC
  • CPGA
  • CQFP
  • SOIC

Production Screening/QCI Testing

  • ASL3000 Analog/RF Testers (Three)
  • ASL1000 Analog Testers (Two)
  • Thermionics TFUs (Three)
  • Hot/Cold Electrical Testing
  • Burn-In Ovens
  • MIL-STD-883 Method 5004
  • HAST Testing
  • Device Marking Capability
  • Dry Pack Capability

IC Handlers for Volume Production

  • PLCC
  • DIP

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