Depending upon the requirements of your program, Device Engineering's staff will employ their years of experience to either utilize state-of-the-art computer aided design tools or hand pack the circuit for maximum density.

Using a composite set of design and layout rules developed through years of operational experience, Device Engineering offers built-in second sourcing to assure product availability at the lowest possible price.

Finally, Device Engineering will meet your most stringent or specialized packaging requirements.  Product can be provided in standard packages, die-in-waffle pack, probed wafer form or custom packages.

Please click on the links below for more information.

• Computer
  Aided
  Design
• Built-In
  Multi-Sourcing
• Hand
  Packing
• Standard
  and Custom
  Packaging