Device Engineering can package your custom circuits in any standard package available in the industry from DIP's to BGA's. Non Standard packages such as heat spreaders are also available. 

• Ceramic DIP
• Plastic DIP
• Side Brazed DIP
• SOIC - NB(150mil) or WB(300mil)
• SSOP
• TSSOP
• BGA
• µBGA™
• Many more...

Packaging info for standard products