ASIC & IC Package Options
Device Engineering's products are offered in many popular packages ranging from DIP's to u-BGA's. While most offerings are in plastic, ceramic is offered when added ruggedness and hermiticity are required. For custom, mixed-signal designs and product respins these same packages may be selected as applicable to your design
Package Types & Diagrams
- DIP (Plastic, Ceramic, Side Brazed)
- SOIC - NB(150mil) or WB(300mil)
- Plastic MLP, QFN, LPCC
- QFP
- CLCC
- SSOP
- TSSOP
- PLCC
- MQFP
- MLPQ
- PGA
- BGA
- µBGA
- TO-can
- J-Lead Cerquad
- Many more...