Integrated Circuit Design
 

Overview

Processes

Design Capabilities

Production Flows

Test Capabilities

Packaging

 

Processes:

Device Engineering possesses design experience in a broad range of Analog and Mixed-Signal IC Processes. A comparison of different technologies used by DEI is shown below:

 

Bipolar

CMOS

BiCMOS

Bipolar Devices

Good Performance

None/ Intrinsic

Medium Performance

CMOS Devices

None

Good Performance

Good Performance

Design Layers

9 - 13

14 - 18

18 - 24

Drive Capability

Very High

Need Large Devices

Use Bipolar

Low Voltage

Low Voltage Capable

Medium Voltage Capable

Lowest Voltage Capable

Power

Medium Power

Low Power

Lowest Power

Digital Density

Medium

Very Good

Very Good

Analog Density

Very Good

Good

Best

Production NRE

Lowest

Medium

Highest

Noise

Lowest

Medium

Use Bipolar Elements

All of these parameters can vary from design to design. DEI uses standard sized IC devices in each process to meet your design needs.

 

Device Engineering is an ISO9001-2000 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.



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Phone:(480) 303-0822  Fax:(480) 303-0824 E-mail: info@deiaz.com