|
Overview
Processes
Design
Capabilities
Production
Flows
Test
Capabilities
Packaging
|
Processes:
Device
Engineering possesses design experience in a broad range of Analog
and Mixed-Signal IC Processes. A comparison of different technologies
used by DEI is shown below:
|
Bipolar |
CMOS |
BiCMOS |
Bipolar
Devices |
Good Performance |
None/
Intrinsic |
Medium
Performance |
CMOS
Devices |
None |
Good
Performance |
Good
Performance |
Design
Layers |
9
- 13 |
14
- 18 |
18
- 24 |
Drive
Capability |
Very
High |
Need
Large Devices |
Use
Bipolar |
Low
Voltage |
Low
Voltage Capable |
Medium
Voltage Capable |
Lowest
Voltage Capable |
Power |
Medium
Power |
Low
Power |
Lowest
Power |
Digital
Density |
Medium |
Very
Good |
Very
Good |
Analog
Density |
Very
Good |
Good |
Best |
Production
NRE |
Lowest |
Medium |
Highest |
Noise |
Lowest |
Medium |
Use
Bipolar Elements |
All
of these parameters can vary from design to design. DEI uses standard
sized IC devices in each process to meet your design needs.
|