Custom ASICS and BiPolar Analog Arrays


	Integrated Circuit Design

Overview

Processes

Design Capabilities

Production Flows

Test Capabilities

Packaging

Packaging:

Device Engineering handles many different plastic and ceramic packages. On-shore packaging is available for ceramic packages on request and for Military flows.

Example packages include, but are not limited to:

Plastic:

MLPQ (see note 1)

MQFP

PQFP

TQFP

LQFP

DIP

PLCC

SOIC

TSSOP

Ceramic:

CDIP

CLCC

CPGA

CQFP

note 1 - An MLPQ is a small form factor surface mount package (32 pins is 5 mm x 5 mm).

Device Engineering is an ISO9001-2000 certified design and manufacturing facility specializing in Analog and Mixed Signal Integrated Circuits.

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