Custom ASICS and BiPolar Analog Arrays

Description

Design Flow

Product Matrix

Prototyping

Packaging

Tools/ Downloads

Documentation

FAQs

Packages:

The 700 Series Arrays include standard packages for development. Additional packages are also available such as MLPQ packages for good power dissipation.Contact Device Engineering to discuss your packaging needs.

Pins	8	14	16	18	20	24	28	40	44	48	52
Plastic
Dual In-Line (DIP), 300 mil	X	X	X	X	X	X
Dual In-Line (DIP), 600 mil						X	X	X		X
Small Outline (SOIC), narrow body (150 mil)	X	X	X
Small Outline (SOIC), wide body (300 mil)			X		X	X	X
Plastic Leaded Chip Carrier (PLCC)							X		X		X
Plastic Quad Flat Pack (PQFP)						X				X	X
Ceramic
Dual In-Line, 300 mil	X	X	X	X	X
Dual In-Line, 600 mil						X	X	X		X
Ceramic Small Outline (CSOP)	X		X
Ceramic Quad Flat Pack (CQFP)							X		X		X

The 700 Series was created by Array Design, Inc.

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